News from TSMC
Stay current with all the latest and breaking news about TSMC, compare headlines and perspectives between news sources on stories happening today. In total, 437 stories have been published about TSMC which Ground News has aggregated in the past 3 months.
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TSMC · San JoseTSMC introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters. At the TSMC 2024 North America Technology Symposium, they debuted the TSMC A16™ technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing ...See the Story
TSMC System on Wafer for Over 3.5 Times the Compute by 2027
TSMC · HsinchuAmpere Computing is leveraging TSMC's 3nm process node for its AmpereOne-3 CPU, offering up to 256 cores, in the coming year. AmpereOne-3 CPU Leverages TSMC 3nm & Chiplet Technology For Up To 256 Cores For Data Centers Ampere Computing has been well involved in the markets, especially the cloud segment, since the firm gained traction in the markets with its lineup of cloud-focused processors, which are known to be some of the most "loaded" ones …See the Story
AmpereOne-3 Chiplet CPU To Feature 256 Cores on TSMC's 3nm Node With PCIe 6.0 & DDR5, Launches Next Year
TSMCWith Bernstein analysts calling on their clients to abandon Intel until at least 2030, the erstwhile behemoth in the chipmaking sphere is at a cyclical nadir and is expected to remain there for the next few years as it continues to lose revenue and surrender its margins. Yet, TSMC's immediate reluctance to adopt the latest lithography tech opens a narrow window for Intel to regain its lost glory. Intel intends to experiment with High-NA Extreme …See the Story
Intel’s Embrace of High-NA EUV Lithography and TSMC’s Reluctance Threatens to Flip the Prevailing Industry Supremacy Paradigm
TSMC · HsinchuAn anonymous reader quotes a report from Tom's Hardware: TSMC announced its leading-edge 1.6nm-class process technology today, a new A16 manufacturing process that will be the company's first Angstrom-class production node and promises to outperform its predecessor, N2P, by a significant margin. The...See the Story
TSMC Unveils 1.6nm Process Technology With Backside Power Delivery
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Apple · HsinchuApple recently introduced its M3 series of chips which are fabricated on TSMC's 3nm architecture for enhanced performance and efficiency. Today. TSMC has announced that it will be advancing forward in the field and introducing 1.6nm chips with major performance and efficiency gains. The supplier has been constantly working on a wide range of technologies, including the "A16" process, which is the supplier's forthcoming 1.6nm node. Apple's chipma…See the Story